Difference between revisions of "Team:Oxford/Parts"

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<h3 id="Csp1">TAT Csp1</h3>
 
<h3 id="Csp1">TAT Csp1</h3>
 
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<p>
Csp1 is a tetramer of four-helix bundle sub units. Each monomer can bind up to 13 Cu(I) ions meaning that the tetramer binds a maximum of 52 copper ions. Vita <i>et al.</i> crystallised Csp1 with and without copper bound. The copper is bound inside the pre-folded helical bundles by Cys residues in contrast to metallothioneins, which are unstructured until they fold around metal ion clusters. Vita <i>et al.</i><sup>(1)</sup> found an average copper affinity of approximately 1x10<sup>17</sup>M<sup>-1</sup>.
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Csp1 is a tetramer of four-helix bundle subunits. Each monomer can bind up to 13 Cu(I) ions meaning that the tetramer binds a maximum of 52 copper ions. Vita <i>et al.</i> crystallised Csp1 with and without copper bound. The copper is bound inside the pre-folded helical bundles by Cys residues in contrast to metallothioneins, which are unstructured until they fold around metal ion clusters. Vita <i>et al.</i><sup>(1)</sup> found an average copper affinity of approximately 1x10<sup>17</sup>M<sup>-1</sup>.
 
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Revision as of 21:01, 18 October 2016

iGEM Oxford 2016 - Cure for Copper