Difference between revisions of "Team:SUSTech Shenzhen/Hardware"

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Both PDMS and glass contains silicon element. When they were treated by oxygen plasma, unstable hydroxyl group will form on the treated surface. When they get close enough, two hydroxyl group will dehydrate and bond together covalently.
 
Both PDMS and glass contains silicon element. When they were treated by oxygen plasma, unstable hydroxyl group will form on the treated surface. When they get close enough, two hydroxyl group will dehydrate and bond together covalently.
  
== Detailed Protocol ==
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<html><a href="/Team:SUSTech_Shenzhen/Notebook/Fabrication" class="btn">Detailed Protocol</a></html>
 
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Wash the glass mask holder by socking it in dilute ammonia water for over 1 hour, and refresh it with deionized water.
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Wash the glass mask holder by socking it in dilute hydrochloric acid for over 1 hour, and refresh it with deionized water.
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Wash the glass mask holder by socking it in positive photoresist remover for over 1 hour, and refresh it with deionized water.
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Dry the glass mask holder in the drying oven.
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Clean the mask film by wiping the two sides carefully on one direction with a clean paper socked in acetone.
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Clean the mask for the second time film by wiping the two sides carefully on one direction with a clean paper socked in alcohol or isopropyl alcohol.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Cleaning-Photomask.jpeg|caption=Fig. 4 Cleaning Photomask}}
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Fix the mask film on to the mask holder with tape.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Fixing-Photomask.jpeg|caption=Fig. 5 Fixing Photomask}}
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<blockquote>The tape can only touch the edges of the mask film in order to prevent contamination.
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</blockquote>
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Pour some SU-8 2100 photoresist in a small bottle, keep it still in the refrigerator for at least a week(two weeks recommend) to remove the bobbles inside the photoresist.
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Take the SU-8 photoresist out from the refrigerator, wait until the bottle hit room temperature, and carefully pour it on to a clean silicon wafer. The bottle should be held as close to the wafer as possible to prevent bobble from generating.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Pouring-Photoresist.jpeg|caption=Fig. 6 Pouring Photoresist}}
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Spin the wafer with photoresist on the spin coater with the following procedure.
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Spin at 500 rpm for 10 seconds with acceleration time of 5 seconds.
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Spin at 2000 rpm for 30 seconds with acceleration time of 5 seconds.
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Spin at 500 rpm for 5 seconds with acceleration time of 5 seconds.
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Stop with acceleration time of 5 seconds.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Prepare-Spin-Coating.jpeg|caption=Fig. 7 Prepared to be Spin Coated}}
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Spin-Coating.jpeg|caption=Fig. 8 Spin Coating}}
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Bake the wafer on 65℃ hotplate for 5 minutes.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Soft-Bake-at-65deg.jpeg|caption=Fig. 9 Soft Bake at 65℃}}
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Bake the wafer on 95℃ hotplate for 30 minutes.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Soft-bake-at-95deg.jpeg|caption=Fig. 10 Soft Bake at 95℃}}
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Keep the wafer still in room temperature for more than 1 hour and wait until the photoresist is dry enough.
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Clean the backside of the wafer with a clean paper socked in SU-8 developer to remove excessive photoresist.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Cleaning-the-backside.jpeg|caption=Fig. 11 Cleaning the Backside}}
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Fix the wafer to the mask aligner.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Fixing-the-Wafer.jpeg|caption=Fig. 12 Fixing the Wafer}}
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Place the mask holder on the wafer carefully.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Fixing-Photomask.jpeg|caption=Fig. 13 Placing the Photo Mask}}
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Expose the wafer with the mask aligner with the exposure energy of 220 mJ/cm<sup>2</sup>.
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Bake the wafer on 65℃ hot plate for 5 minutes.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Post-Exposure-Bake-at-65deg.jpeg|caption=Fig. 14 Post Exposure Bake at 65℃}}
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<blockquote>A visible pattern identical to the photomask will be seen in the film within 5 seconds after being placed on the hotplate.
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</blockquote>
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Pattern-seen-during-post-exposure-bake.jpeg|caption=Fig. 15 Pattern Seen During Post Exposure Bake}}
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Bake the wafer on 95℃ hot plate for 12 minutes.
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Keep the wafer still in room temperature for 15 minutes and wait until the photoresist is dry enough.
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Pour fresh SU-8 developer into the container. Place the container on the shaking table and set the speed to 400rpm. Start the shaking table and wait for the speed to be stabilized.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Pouring-developer.jpeg|caption=Fig. 16 Pouring Developer}}
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Put the wafer in the container and develop for 4 minutes.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Developing.jpeg|caption=Fig. 17 Developing}}
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Spray and wash the developed image with fresh developer for approximately 10 seconds.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Spraying-developer.jpeg|caption=Fig. 18 Spraying Developer}}
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Spray and wash the developed image with isopropyl alcohol for approximately 10 seconds.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Spraying-Isopropyl-Alcohol.jpeg|caption=Fig. 19 Spraying Isopropyl Alcohol}}
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Air dry the wafer with nitrogen gun.
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Bake the wafer on 150℃ hot plate for 20 minutes.
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Check the developed image.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Check-the-Developed-Image.jpeg|caption=Fig. 20 Checking Developed Image}}
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Curing.jpeg|caption=Fig. 21 Curing}}
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Wait for the wafer to cool down.
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Check the final image of the photoresist. The final image usually has a lot of defects at the edges of the channels. And due to the low transmittance of SU-8 photoresist to the low-wavelength light, the photoresist at the top side of the channel will absorb higher energy than the photoresist at the bottom, causing a trapezoidal cross section profile.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Topside-View-SU8-5x.png|caption=Fig. 22 Topside View of SU-8 Photoresist (5X)}}
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Topside-View-SU8-20x.tif|caption=Fig. 23 Topside View of SU-8 Photoresist (20X)}}
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Optical-Transmittance-of-SU8.png|caption=Fig. 24 Optical Transmittance of SU-8 Photoresist}}
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Cross-Section-Profile-of-SU8-under-SEM.jpg|caption=Fig. 25 Cross Section Profile of SU-8 Photoresist under SEM}}
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Mix about 30g PDMS base with about 3g curing agent (at the ratio of 10:1).
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Wrap the wafer with tinfoil and pour the PDMS mix on to the wafer.
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Put the wafer in the vacuum dryer to remove the bobbles inside.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Removing-Bubbles.jpeg|caption=Fig. 26 Removing Bobbles}}
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Bake the wafer in the 80℃ drying oven for 3 hours.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Baking-PDMS.jpeg|caption=Fig. 27 Baking PDMS}}
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Take the wafer out and rip off the tinfoil.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Baked-PDMS.jpeg|caption=Fig. 28 Baked PDMS}}
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Carefully remove PDMS from the wafer and cut it into pieces on a piece of clean paper.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Cutting-PDMS.jpeg|caption=Fig. 29 Cutting PDMS}}
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--PDMS Slices.jpeg|caption=Fig. 30 PDMS Slices}}
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Spray and wash the PDMS with alcohol.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Spraying-Alcohol-on-PDMS.jpeg|caption=Fig. 31 Spraying Alcohol}}
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Spray and wash the PDMS with deionized water.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Spraying-Deionized-Water-on-PDMS.jpeg|caption=Fig. 32 Spraying Deionized Water}}
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Air dry the wafer with nitrogen gun.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Air-Drying-PDMS.jpeg|caption=Fig. 33 Air Drying}}
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Soak glass slides in 100g/L NaOH solution for 14~24 hours.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Soaking-Slides.jpeg|caption=Fig. 34 Soaking Slides}}
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Take the glass slides out, spray and wash them with deionized water.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Spraying-Deionizing-Water.jpeg|caption=Fig. 35 Spraying Deionized Water}}
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Spray and wash the glass slides with alcohol.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Spraying-Alcohol-Slides.jpeg|caption=Fig. 36 Spraying Alcohol}}
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Spray and wash the glass slides with deionized water.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Spraying-Deionized-Water-Slides.jpeg|caption=Fig. 37 Spraying Deionized Water}}
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Air dry the wafer with nitrogen gun.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Air-Dry-Slides.jpeg|caption=Fig. 38 Air Drying}}
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Place the clean slides on a piece of tinfoil.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Clean-Slides.jpeg|caption=Fig. 39 Clean Slides}}
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Dry the glass slides in the drying oven.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Drying-Glass-Slides.jpeg|caption=Fig. 40 Drying Glass Slides}}
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Clean the glass slide in the ultra-violet ozone cleaner for 15 minutes.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Cleaning-in-UV-Ozone-Cleaner.jpeg|caption=Fig. 41 Cleaning in Ultra-Violet Ozone Cleaner}}
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Take the slides out and wrap them with another piece of tinfoil.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Wrapped-Slides.jpeg|caption=Fig. 42 Wrapped Slides}}
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Punch the holes for the tube on the PDMS.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Punching-Holes-on-PDMS.jpeg|caption=Fig. 43 Punching Holes}}
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Punching-holes-PDMS-2.jpeg|caption=Fig. 44 Punching Holes}}
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Open the plasma cleaner and place the PDMS and the slide in the meddle. A piece of tinfoil should be placed under the PDMS.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Slide-and-PDMS-in-Plasma-Cleaner.jpeg|caption=Fig. 45 Glass Slide and PDMS in The Plasma Cleaner}}
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Treat them with oxygen plasma for 1.5 minutes at 300W and the oxygen flow rate of 0.6mL/min.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Plasma-Cleaning.jpeg|caption=Fig. 46 Plasma Cleaning}}
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Stop the plasma cleaner and open the cover as soon as possible. Press the treated sides together and apply pressure in 5 seconds.
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{{SUSTech_Image_Center | filename=T--SUSTech_Shenzhen--Bonding.jpeg|caption=Fig. 47 Bonding}}
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Revision as of 11:54, 17 October 2016

Team SUSTC-Shenzhen

Hardware

Model

Introduction

We are aiming to evolve a more sensitive mechanical sensitive channel (MS channel). When MS channels are stimulated by mechanical force, a Ca2+ influx is triggered. To measure the performance of MS channel, we chose sound to produce mechanical force and GECO protein as Ca2+ indicator to reflect the channel sensitivity through its fluorescence change.

Sound part

In this part, we aim to explore the effect different frequency on the cells. Frequencies from 300Hz to 1.7MHz were tried to observe whether the cells with MS channel can response differently to different frequency. If so, frequency orthogonal audiogenetic parts are hopefully to be developed. Meanwhile, the equipment was also designed to be easy to change sonic power, in order to choose the most suitable intensity being harmless to the cells.

Sonic Stimulation

Signal generation

A dual channel function/arbitrary waveform generator (Feel Tech FY2303) was used to generate sound wave signals. It can generate 1uHz to 2MHz, 0v to 20v signals. An amplifier was used to amplify the wave signal output by the wave generator.
Wave Generator

Sound generator

Buzzer
Buzzer is a thin metal plate attached with a piezoelectric ceramic. When varying voltage is added to its two ends, it deforms coordinately. Whereas, its low and high frequency response is weak, and can only be used to generate sound under 15 KHz. For the safety of the cells, we fix it on the bottom of cell dish for cellular stimulation.
Buzzer
Speaker
As the low and high frequency response of buzzer is weak, speaker (Type: rsiym) was chose for complementation. Its power can reach 3W and it was drenched in culture medium for low frequency experiment.
Speaker
Balanced Amateur

Buzzers and speakers both have short comes. For buzzers, sound could mainly be absorbed by cell dish bottom and the power was very weak. Speaker is more powerful though, it is cell toxic and not stable. For more, they both apply normal stress to the cells rather than shear stress. So, we promoted a third plan using balanced amateur.

Balanced amateur is very stable and small. A steel tube was fixed on it to drench in to water. Thus it can generate a shear force horizontal to cell dish, which is closer to the mechanism of human hearing. The problem is that its power is not strong enough to trigger a cellular response.

Balanced Amateur

Lab Circuit

The following is a brief circuit of sound generator circuit.

SUSTech Shenzhen-E8D94FFA-23F3-4BC1-8D7D-1CE281F623C1.png
SUSTech Shenzhen-65A58D56-0C34-41F2-8A49-0CC17C127994.png

ultra sound stimulation

Seeing cellular response increased with stimulating frequency, and hearable sound can hardly trigger strong cellular response. Ultrasound was come up with. There were 4 kinds of ultrasound devices constructed.

Horn-shaped ultrasound generator

We first constructed this device using circuits from ultrasound cleaner. However it was easy to destroy the circuit due to too small load.

Horn-shaped ultrasound generator

Piezoelectric Energy Transducer.

A new ultrasound device was designed seeing the horn-shaped device is too powerful and unstable. Piezoelectric energy transducer was chose for a much slighter stimulation.

Piezoelectric Energy Transducer
Ultrasound signal generator:

KINGCHIP SD02-JSQ-V2.4 circuit, 5V DC input. 1.7MHz output.

Ultrasound Signal Generator
Power control:

The signal output from KINGCHIP SD02-JSQ-V2.4 circuit was input to the following conrol circuit designed by ourselves. Output power can be controled by changing resistance. Microproccsor Arduino UNO was rogrammed to control stimulation time pattern.

Power Control
Energy Transducer:

1. 1MHz energy transducer used in fog generator was used to generate stable ultrasound. Cell toxity experiment show that it has little and tolerable cell toxity.

Energy Transducer

2. For quantified stimulation, a calibrated ultrasound energy transducer was used.

Data

Diameter: 8.5mm

Thinness: 22mm

For 23Vp-p 1MHz input, 1.9W/cm2 (3mm for from head)

Piezoelectric Energy Transducer

Lab Circuit

Device I

Two 1MHz low power ultrasound stimulators are implemented for program controlled exeriment.

Device I
Device II

One 1MHz ultrasound stimulator was implemented with larger size and maximun power. Control part and electric part were seperated into two layers for safety.

Device II①
Device II②

1. Stimulation program loading.

2. Fix stimulator in proper position.

3. Turn on the switch and change resistance for proper ultrasound intensity.

4. Start stimulation experimrnt.

Microfluidics

Why Microfluidics

Microfluidics is a multidisciplinary field intersecting engineering, physics, chemistry, biochemistry, nanotechnology, and biotechnology, with practical applications in the design of systems in which low volumes of fluids are processed to achieve multiplexing, automation, and high-throughput screening.[1] Microfluidic instrument allows fluids to pass through different tunnels of different diameter, usually ranging from 5 to 500 μm.[2] Owning to its characteristic of small dimension. It can save reagents and also haves smaller requirement of samples. In the last decades, the basic techniques of microfluidics for the study of cells such as cell culture, cell separation, and cell lysis, have been well developed. Based on cell handling techniques, microfluidics has been widely applied in the researches of the cell biology.[3]

T--SUSTech Shenzhen--Photomask-Made.jpeg
Fig. 1 Photomask we made to fabricate the microfluidics chip

In our project, to diminish the misgiving because of transfection and quantitively analyze the following experimental result, we have to test if different shear stress will result in different cellular response . With a pump applied, accurate flow rate controlling can be achieved in microfluidic chips. After calculation and simulation of fluid dynamics, relationship between the shear force on the cellular membrane and fluorescence intensity of the cells can be gotten.

As the dimensions of the microfluidic devices are reduced, physics characteristics in conventional laboratory-scale is not applied. Usually the fluid flow in microfludic chips is laminar flow(Reynolds number<3). It leads to a drastic simplification of the complex Navier-Stokes equations describing fluid mechanics. For these reasons, dedicated microfluidic instruments have been designed to precisely control fluids inside microchannels. Each time when we applied a constant pumped inflow, cells in 3 different observation tunnel would receive corresponding small, middle, large, 3 level of force magnitude(around 1: 9: 81). By changing the pumped flow rate, we could measure MS channel response under a series of force with different magnitude order.

T--SUSTech Shenzhen--pasted-image-124.png
Fig. 2 The design of microfluidic chip

Syringe pump programmed by ourselves is a great tool for stimulation of accurate intensity and duration. In our experiment, the fluid flow will be maintained for about 2 min. And only after the cells have recovered from the last experiment (indicated by reverting to normal fluorescence intensity), would we start the next round of shear force stimulation.

During the experiment, the cells must tightly adhere to the channel bottom, by treating microfludics tunnel with gelatin, cell could adhere to the treated surface of glass slide. Once the cell have adhere to the glass slide, syringe pump was used to control the influx of medium to generate a shear stress on every channel walls. The fluorescence intensity of the cells would increased within a second by using R-GECO as an indicator of the intracellular calcium concentration. Live cell imaging system can capture its signal and record the data throughout whole experimental period, then, Matlab analysis was applied. For the cells which has a longer response time employing NFAT signal pathway, the change of gene expression(green fluorescent as downstream) can be observed under live cell imaging system after 20 hours.

Microfluidic chips in our experiment were made by polydimethylsiloxane (PDMS) fixed on a slide of glass. PDMS is the material for fast prototyping microfluidic devices. PDMS chips are widely used in laboratories, especially in the academic community due to their low cost and ease of fabrication. Here are listed the main advantages of such chips:

  1. Oxygen and gas permeability
  2. Optical transparency, robustness
  3. Non toxicity
  4. Biocompatibility
  5. No water permeability

One of the main drawbacks of PDMS chips is its hydrophobicity. Consequently, introducing aqueous solutions into the microchannels is difficult and hydrophobic analytes can adsorb onto the PDMS surface. Fortunately, there are now PDMS surface modification methods such as gas phase processing methods and wet chemical methods (or combination of both) to avoid issues due to hydrophobicity which we also employed in our experiment. After the fabrication of microfluidics channels having been done made by polydimethylsiloxane, they are treated with oxygen plasma for hydrophilic property. After this procedure, polydimethylsiloxane could bond to glass tightly.

How to fabricate

After reading existing papers about the processing technology typically used in microfluidic chips production and endless trial experiment, we have formed our own processing protocol based on our equipments and requirements.

The microfluidic chips used in our project were all produced using this protocol.

Process Overview

T--SUSTech Shenzhen--bonding-process.png
Fig. 3 Process Overview

SU-8 Photoresist can cross-link to a network of polymer when exposed to short wavelength light. If the cross-linked network has formed, it cannot be dissolved by the SU-8 developer. So if we place a photo mask to shade the light shine on the photoresist, we can make a copy of the pattern on the photo mask.

Both PDMS and glass contains silicon element. When they were treated by oxygen plasma, unstable hydroxyl group will form on the treated surface. When they get close enough, two hydroxyl group will dehydrate and bond together covalently.

Detailed Protocol

Made by from the iGEM team SUSTech_Shenzhen.

Licensed under CC BY 4.0.